The semiconductor packaging and assembly equipment is effectively utilized for an assimilated chip to perform, it requires to be linked to the package or straight to the printed circuit. This includes wire bonding, die-bonding, and dicing. Also, it is a back end procedure of chip establishment. Semiconductor ICs around the several sectors has augmented the requirement for semiconductor packaging and assembly equipment. The growth in the involves of semiconductor IC designs mainstream fuels the market. In the present era, it has been witnessed that there is an augment in the requirement for semiconductor ICs that can function several functions. Subsequently, the merchants have improved the semiconductor ICs with the multifaceted architecture to address the increment in the requirement for multi-functional ICs. The improvement of the complex semiconductor ICs is a critical aspect that compels the market growth during the review duration.

According to the report analysis, ‘Asia-Pacific Semiconductor Packaging and Assembly (P&A) Equipment Market: Insights and Forecast 2018-2025: Emphasis on Process Type (Plating, Inspection and Dicing, Wire Bonding, Die-Bonding, Others (Including Packaging)), Application (Consumer Electronics, Communication, Automotive, Industrial, Other) and Country’ states that in the Asia Pacific semiconductor packaging and assembly (P&A) equipment market there are numerous key players which recently performing more positively for leading the fastest market growth and registering the high value of market share during the forecasted period while augment in the sales of smart phones and other smart consumer electronic devices, developed medical applications and equipment, increasing the scope in the Internet of Things and wide improvement of new assembly procedure includes Amkor Technology Inc, Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co. Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technology Inc., ASE Group and several others.

In terms of revenue, the semiconductor packaging and assembly equipment in Asia Pacific has accounted an astounding the growth with positive CAGR during the review period of 2019-2025. The semiconductor packaging and assembly equipment market in Asia Pacific region has observed an overall an effective augment in the market dissemination in the last few years. The Internet of Things and automation in automobiles has boomed up the semiconductor market. The effective utilization of the semiconductor ICs for automated driving, automatic braking system, GPS, power doors and windows has further deteriorated the market growth.

Whereas, Taiwan receipts the upper hand in the semiconductor packaging and assembly equipment technology market followed by China. Taiwan vestiges well ahead of China in IC fabrication as Taiwanese manufacturers have massive recompenses in technology over other regions involving China. Not only has this based on the application, the Semiconductor packaging and assembly equipment technology market in Asia Pacific procured concentrated revenues from communication. On the other hand, the automotive application sector is estimated to display a wide growth in years to come owing to the augment in requirement of automated automobiles.

Furthermore, on the basis of process, the die bonding process controlled the overriding share in semiconductor packaging and assembly equipment market. Base band is majorly incorporated into mobile and consumer electronics devices, this is impelling the ascendancy of die bonding in the market. Plating procedure is predicted to be the fastest increasing. Therefore, in the near years, it is anticipated that the Asia Pacific Semiconductor Packaging and Assembly Equipment market will increase more positively over the near years.

For more information on the research report, refer to below link:-

Asia Pacific Semiconductor Packaging and Assembly Equipment Market

Related Report:-

Global Semiconductor Capital Equipment Market Size Study By Equipment Type (Automated Test Equipment, Die-Level Packaging & Assembly Equipment, and Wafer-Level Manufacturing Equipment), By End-User (Memory manufacturers, Foundries, and IDMs), and By Regional Forecasts, 2018-2025

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