The difference between ceramic crystal and metal crystal
First of all, it is the difference in material. One type of ceramic is what we usually call ceramic crystal. The other is a metal which is what we usually call a quartz crystal. Of course, some quartz crystals also use ceramic materials, but the chips inside are made of quartz. We still call them quartz crystals. In many cases, quartz crystals can replace ceramic crystals.
The difference between ceramic crystal and metal crystal packaging
Crystals are divided into ceramic and metal surface packaging. The ceramic or metal casing used for packaging refers to the ceramic or metal casing used to encapsulate electronic components and protect the electronic components inside. Due to its excellent comprehensive characteristics, ceramics are widely used in high-reliability microelectronic packages. Because of its excellent performance, ceramic packages are widely used in aerospace, military and many large computers.
With the continuous improvement of the performance requirements of various aspects of electronic products, ceramic packaging shells have been widely used in high-reliability and high-power electronic devices. Chips need packaging shells to ensure mechanical protection and reliable sealing, and have a good relationship with the outside world. Of electrical and thermal conductivity. This requires ceramics to be able to seal well with different metals, and the metallization process is a key process. Metallization refers to sintering or depositing a layer of metal on the ceramic so that the ceramic and metal can be sealed together with high quality. The quality of the metallization directly affects the airtightness and strength of the package. Due to the relatively high technical barriers in the R&D and production of the ceramic packaging industry, the price of practical products is relatively high. In the consumer group of the product, it is suitable for high-income groups. In the developed coastal areas, the per capita income of consumer groups is relatively high.
The rapid packaging market for integrated circuits has gradually formed, which is related to the increase in the design and development of integrated circuits in my country and the increase in new wafer process lines. Because domestic technology, market, talent and cost have significant advantages over foreign countries, it directly leads to foreign companies. The metal casing production line began to transfer to the country. The ceramic package used in the automotive electronics field has increased significantly, and the progress has been more obvious. While my country’s automobiles are in the stage of recovery and development, the increase in the use of ceramic packaging will be more obvious. The metal and ceramic packaging industry chain is also constantly improving, and the scale of the industry is gradually expanding. Among them, companies with relatively strong technical strength have increased significantly, but no industry leader has emerged, nor has it formed a clear scale advantage. The price advantage of the original small metal casing is gradually diluted by thinning, miniaturization, and lightweight requirements, which inhibits the development and production of metal casings to a certain extent.
