China PZ22 Supplier supplies Copper clad laminate (CCL), the PCB substrates, which are the most extensive and highly used to fabricate the boards. And the copper-clad laminate is a form of substance that soak in resin with the electronic glass fiber or other strengthening material to make with copper-clad on either side or both sides. Also, they are highly applicable in the electronic market and used for numerous applications such as television, computer,  radio, mobile communications and other electronic products.

Here is the classification of four types of Copper clad laminate and their well-known benefits.

Copper clad laminate (CCL) types

There is a lot of form of Copper clad laminate based on different standard of classification. These classifications distinguish based on their composition and manufacturing. Here is the list of types of Copper clad laminate.

  1. Classified by reinforcing material: the CCl that is classified based on material is Paper base CCL ( such as XPC), Glass fiber cloth base CCL (such as FR-4, FR-5), Compound CCL ( such as CEM-1, CEM-3), and Special material base CCL (such as metal-base CCL, ceramic-base CCL and so on)
  2. Classified by applied insulation resins: the CCL which is classified on the bases of resin are Phenolic resin CCL (such as XPC, XXXPC, FR-1, FR-2 and so on), Epoxy resin CCL (FR-3), and Polyester resin CCL
  3. Classified by performance: some of the CCL are classified based on their implementation like General performance CCL, CCL with high heat resistance, CCL with low dielectric constant, CCL with low CTE (Coefficient of Thermal Expansion)
  4. Classified by mechanical rigidity: some are classified on it rigidity like Rigid CCL and Flexible CCL

Applications of Copper Clad Laminate

Copper-clad laminate is beneficial to use and have multiple applications such as:

  • Connectors & oscillation reeds
  • Garments accessories (eyelet, etc.)
  • PCB field
  • PCB collector (electrode backing) materials
  • Electric and electric springs, switches
  • Communication cable
  • Mobile phone mainboard
  • Cable armoring
  • Ion battery production lamination with PI film
  • Lead frames