Stealth dicing is a technology that is used in almost every sector in the world and most commonly in the defense industry. The industries that use the MEMS method or the contractors in the defense sector are very well aware of the term ‘stealth dicing’ as they heard this word every day. Only a few in the defense industry have not welcomed the concept due to the cost of the technology but mostly have fully adopted this method. In this technique, the material is cut down from the center point with the help of a laser beam that can penetrate the material. Various methods are used for material cutting such as wafer dicing, traditional blade slicing, diamond blade cutting, and stealth dicing is one of them. You need to select the right method for cleavage according to your project. Learn about the different cleavage methods as they depend upon the orientation of the crystal and the type of substrate.
Speed and cost of the process are one of the main concerns for the engineers and low cost and high speed is equal to more production of the daily use devices. We are living in the world of electrical devices such as cars and home appliances and the advancement in technology allows us to control these devices remotely. Micro electro-mechanical system (MEMS) is the revolution that made this advancement possible and the stealth dicing process has a great role in this technology. MEMS are the future of technology and it is making new things for the world or pushing things forward in IoT (internet of things). Semiconductor wafers are used to produce MEMS chips and the stealth dicing technology is preferred for cutting these semiconductor wafers. The wafers are cut into individual elements and MEMS chips. Different methods were used in past to cut these wafers but stealth dicing (SD) is found more suitable and the latest method. This technique evolved because of the many advantages and fewer flaws and defects as compared to the other cutting methods. Here are a few advantages that we’ll discuss in this article:
1. Production of Small-Size Dies
You can make diced silicon chips at sigh tensile stress and low temperature by applying a stealth dicing process. It is a very productive and efficient method for any type of wafer and has the capability to make nanometer or small-size dies. The quantity of the production must be large enough as it does not require tape expansion or water.
2. Reduce Heat Transfer
Stealth dicing is a process that can reduce heat transfer during cutting. It cuts the upper surface of the wafer without producing any crack on it by using bare Si. Bare Si does not allow heat transfer because of its special properties. The order quantity must be high enough in this as well to get the advantage of reducing heat transfer.
3. Safe Process
Being environment friendly is one of the major advantages of the stealth dicing process as it does not use any water or heat. This dicing process is more beneficial and effective in the long run with little heat and water usage which made this method a safe one. The process is more suitable for brittle and delicate materials as compared to other processes. Consumption of water and electricity decreases greatly to protect the environment. The semiconductor is one example that is manufactured through stealth dicing.
4. High-Quality Production
High-quality production is one of the features of stealth dicing that made this method stand out among the other conventional methods. It produces highly precise, error-free, and flawless chips of semiconductor wafers in the singulation process. The high-quality yield is possible because of the high-intensity laser beam that is pointed and condensed towards the center of the semiconductor wafer after passing through it. The localized point and the incidence of the beam can be controlled by manipulating the wavelength as the energy is absorbed through these localized points which are helpful in producing high-quality chips. Stealth dicing cuts the semiconductor wafer from inside to outside unlike the other conventional methods of cutting that cut the wafer from outside to inside.
5. No Harm to Silicon Surface
The stealth dicing process does not alter the surface of the silicon wafer which is one primary advantage of this method. A row of gaps is created under the surface of the wafer to achieve this goal. To avoid the contamination and dry point at the front and back surfaces of the wafer, high width and wavelength with laser beam pulse play a vital role. Superfine and small-scale defects can be created in a silicon wafer by using this method. For the manufacturing of different devices, the dicing of silicon wafers through the stealth dicing process is very crucial. Skilled operators and precise machinery are required to produce accurate dice. You can get single dice from one wafer by using this process. The industry of dicing semiconductor wafers is growing significantly and a stealth dicing system should be your first choice if you want to grow in this industry.
6. Fastest Method
You can cultivate a large number of wafer dices in less time with the stealth dicing process as it is the fastest method compared to the others. The speed of production is a very essential factor especially in manufacturing MEMS system that is used to produce different electrical devices and products. Quick turnaround of products with high speed can reduce the long queues of uncut wafers that are attractive for manufacturers or GDSI companies. It is appropriate for low-tech dicing as the production is low in high-tech procedures. It is an expensive method as it does not use any water or air but found the best method for small-scale batch size. The process is not only fast but also protects the fragile electronic circuits as well while fabricating the product without damaging the surface of the wafer.
7. Excellent Choice for Ultra-Thin Semiconductor
The extension of the stealth dicing layer in the wafer surface can be controlled by handling the wavelength of the beam that allows the penetration without breaking the wafer. This feature made stealth dicing an excellent choice for ultra-thin semiconductors. The process utilizes less power and high speed that provides a high K value while cutting the material. Using low-power lasers also makes this process environment-friendly. You need a large amount of particular equipment to get this process done or make it suitable for extra thin wafer dicing.
